Conductive composition for low frequency EMI shielding
US10827660B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 27, 2018 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Apr 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0088
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a conductive compositions for low frequency EMI shielding. An EMI shielding composition according to the present invention comprises a resin comprising a thermoplastic resin and/or a thermoset resin, a solvent and/or a reactive diluent and particles, wherein said particles comprise a mixture of magnetic particles and electrically conductive particles or magnetic particles coated with electrically conductive material or a mixture of magnetic particles coated with electrically conductive material and electrically conductive particles and wherein, said composition comprises ≥10% magnetic particles by weight, by total weight of the composition. The EMI shielding composition according to the present invention has good electrical and magnetic conductivity and is suitable as a drop-in solution for EMI shielding in a wide frequency range, and especially at low frequency ranges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.