Debondable adhesives and uses thereof
US10827799B2 · kind B2 · utility
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1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2018 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Mar 4, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/502
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Debondable adhesive compositions are provided. This disclosure also provides articles of footwear and components for articles of footwear including a debondable adhesive matrix. The debondable adhesive matrix can allow for the bonding and debonding of two substrates in the article of footwear or component thereof. This disclosure also provides methods of making the debondable adhesive compositions and methods of using said compositions for bonding and debonding the substrates, e.g. for bonding and debonding of an upper and an outsole in an article of footwear.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.