Assembly method by silver sintering without pressure
US10828697B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2016 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Nov 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1131
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An assembly method for assembling a first element to a second element by pressureless metal sintering, the method having a preparation step during which a sintering material is arranged at a bond interface of the elements, a pre-sintering step during which the assembly is heated for a first duration that is longer than five minutes at a first temperature that is higher than 200° C. and strictly lower than or equal to the temperature for activating diffusion at the grain boundaries, and a densification step during which the assembly is heated for a second duration at a second temperature that is higher than or equal to the temperature for activating diffusion at the grain boundaries.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.