Method for manufacturing thin-walled structures in layers
US10828699B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2012 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Feb 15, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention concerns a method for manufacturing at least one thin-walled structure (1,11,13,17,18), whereby this structure is built layer by layer by applying successive powder layers extending substantially horizontally and by moving an energy beam over each of these powder layers according to a predetermined pattern so as to make said powder melt and subsequently make it solidify or sinter, such that successive layers connected to each other of said thin-walled structure (1,11, 13,17,18) are formed which extend according to a horizontal cross section of this thin-walled structure (1, 11,13,17,18). According to the method a support structure (20) is built in layers together with said thin-walled structures (1,11,13,17,18) and connected to it such that a rigid unit (14) is manufactured, whereby after building this unit (14) layer by layer, at least the thin-walled structures (1,11,13,17,18) are annealed in order to at least partly eliminate any stresses present, and whereby both structures are separated from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.