Device for punching thin-walled materials
US10828796B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2016 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Nov 21, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/9309
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A device by which thin-walled materials, such as labels and flat lids for containers, can be punched in micro or small quantities. The device includes a band steel cutting edge (11) that is elastically mounted in the punching direction. The matrix is likewise elastically held on the matrix plate perpendicular to the punching direction by virtue of a matrix seat (33) fastened to the region in the matrix plate (27) that is adjacent to the opening (29). On the matrix seat, an elastically deformable intermediate plate (47) is placed, and the matrix (55) is placed on the intermediate plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.