Overmolded lead frame assembly for pressure sensing applications
US10830656B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2018 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Jan 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A process of forming an overmolded lead frame assembly for a pressure sensing application includes clamping both sides of a lead frame to performing a primary overmolding operation to prevent resin flash on wire bonding areas on the lead frame. The process also includes performing the primary overmolding operation to form a primary mold that covers selected portions of the lead frame on first and second sides of the lead frame assembly. The primary mold forms an electronics cavity on the first side of the lead frame assembly to enable subsequent wire-bonding of a microelectromechanical system (MEMS) pressure sensing element to the wire bonding areas. The process further includes performing a secondary overmolding operation to form a secondary mold on the second side of the lead frame assembly. The secondary mold covers an exposed portion of the lead frame beneath the wire bonding areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.