Method of producing an electronic device
US10832113B2 · kind B2 · utility
0Cited by
61References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2018 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Jun 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for producing an electronic device are disclosed. An adhesive material is jetted in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.