Apparatuses of bonding substrates and methods of bonding substrates
US10833047B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2019 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Mar 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/94
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate bonding apparatus includes a lower chuck, an upper chuck, an electric actuator on a central portion of the upper chuck, a pressure sensor, and a controller. The lower chuck may support a lower substrate, the upper chuck may face the lower chuck such that a lower surface of the upper chuck faces the upper surface of the lower chuck, and the upper chuck may support an upper substrate. The electric actuator may lower a bonding pin through the upper chuck to apply a pressure to the upper substrate supported on the upper chuck. The pressure sensor may be below the lower substrate supported on the lower chuck. The pressure sensor may sense a lowering pressure applied by the bonding pin to the pressure sensor in real time. The controller may control the lowering pressure applied by the bonding pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.