Interposer, electronic substrate, and method for producing electronic substrate
US10833050B1 · kind B1 · utility
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1References
14Claims
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Assignee
Inventors
Key dates
| Filing date | Aug 2, 2019 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Aug 2, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1434
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interposer is capable of efficiently reinforcing the connecting portion between an electronic component and a substrate. The interposer is used for mounting a first electronic component on a substrate and includes a sheet-shaped spacer having at least one through-hole and including a material that does not flow during reflow soldering and a resin portion that covers at least a part of the spacer and is flowable during reflow soldering, and the through-hole is configured to store a bump of the first electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.