Method for manufacturing a cover for an electronic package and electronic package comprising a cover
US10833208B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2019 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Sep 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.