Thermal management method and apparatus for high frequency IC with apertured heat sink
US10833391B2 · kind B2 · utility
0Cited by
3References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 5, 2018 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Feb 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An integrated circuit system has a die with first and second sides, and contains high frequency circuitry operating at mm-wave frequencies. The system also has a plurality of interfaces (on the first side) in electrical communication with the high frequency circuitry, and a heat sink having a bottom surface with a first region and an aperture region. The first region is in physical and conductive contact with the die, while the aperture region forms a concavity with an inner concave surface that is spaced from the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.