Method for producing an electrically conductive bond between an electrical line and an electrically conductive component and assembly produced using the method

US10833426B2 · kind B2 · utility

Assignee

• ElringKlinger AG · DE

Inventors

• Udo Hoenle · Rottenburg am Neckar, DE
• Mark Laderer · Grabenstetten, DE
• Moritz Bertsch · Neuffen, DE
• Ulrich Sauter · Tiefenbronn, DE

Key dates

• Filing date: Jul 21, 2015
• Grant date: Nov 10, 2020
• Expiry date: Jul 21, 2035

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/4922
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

To provide a method for producing an electrically conductive bond between an electrical line, which includes a plurality of individual conductors, and an electrically conductive component, including producing from a crimp element blank a crimp element enclosing portions of the individual conductors, the crimp element including a continuous side and a discontinuous side, at which edge regions of the crimp element lie opposite one another, and substance-to-substance bonding of the crimp element with a contact surface of the component, which is simple to carry out and nevertheless always results in a robust substance-to-substance bond between the crimp element and the component, it is proposed that the crimp element be produced in such a way that the continuous side of the crimp element includes two bearing surfaces which are spaced from one another, at which the crimp element is substance-to-substance bondable to the contact surface of the component.