Patent · US Active

Hermetic chip on board

US10834825B1 · kind B1 · utility

6Cited by
6References
18Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMay 8, 2019
Grant dateNov 10, 2020
Priority date
Expiry dateMay 8, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/107
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A low permeability laminate film includes one or more low moisture permeability homogeneous polymer films with a total thickness between 0.5 and ten mils without glass or ceramic fillers and with a moisture permeability measured at 37° C. and 100% RH of less than 2.6 E-05 atm·cc·mm/in2·sec of air. The polymer film includes one of polychlorotrifluoroethylene, polytetrafluorethylene, fluorinated ethylene propylene, and perfluoro alkoxy alkane. The low permeability laminate film further includes a nanolaminate including alternate combinations of nanolaminate material that is selected from the group consisting of alumina, titanium dioxide, zirconium oxide, beryllium oxide, hafnium oxide, titanium oxide, silicon nitride, tantalum nitride, silica, parylene F, parylene AF-4, parylene HT® and PTFE (polytetrafluoroethylene). A resulting coated nanolaminate film has a moisture permeability less than an equivalent standard leak rate per square inch of 3.0 E-08 atm·cc/in2·sec of air.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.