System for potting components using a cap
US10834827B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2017 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Jul 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1311
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A housing assembly includes a housing, a printed circuit board (PCB) contained in a housing, and a cup-shaped cap having an interior and a flange portion. A tall component extending from the PCB is covered by the cap such that the tall component is disposed in the interior of the cap and the flange portion of the cap engages the PCB. A vacuum is applied and while maintaining the vacuum, an encapsulant is introduced into the housing to a level so as to cover the PCB and certain other components not the relatively taller component(s). When the vacuum is released, a pressure differential between the environmental pressure and the vacuum remaining in the cap interior forces encapsulant into the cap interior to a level higher than that outside of the cap. A multi-level height potting process is achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.