Solder flux
US10835999B2 · kind B2 · utility
0Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2015 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | May 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3489
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is provided the use of at least one ionic liquid as a soldering/brazing flux. There is also provided a method of soldering a metal comprising applying a solder/braze comprising a flux to a surface of the metal and heating said metal to a desired soldering/brazing temperature, wherein the soldering/brazing flux comprises one or more ionic liquids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.