Flux, solder paste, and method for forming solder bump
US10836000B2 · kind B2 · utility
0Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2018 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Oct 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flux includes a rosin resin, an activator, a thixotropic agent, and a solvent. The solvent includes 30% by mass or more and 60% by mass or less monovalent alcohol with respect to a total mass amount of the flux. The monovalent alcohol has 18 or more and 24 or less of carbon atoms in one molecule.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.