Apparatus for controlling the exposure of a selective laser sintering or laser melting apparatus

US10836103B2 · kind B2 · utility

Assignee

• Concept Laser, GmbH · DE

Inventors

• Frank Herzog · Lichtenfels, DE
• Florian Bechmann · Lichtenfels, DE
• Markus Lippert · Lichtenfels, DE
• Johanna Windfelder · Breitbrunn, DE

Key dates

• Filing date: Jun 13, 2018
• Grant date: Nov 17, 2020
• Expiry date: Jan 21, 2039

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P10/25
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

A method for controlling the exposure of a selective laser sintering or laser melting apparatus. The method includes providing a selective laser sintering apparatus or laser melting apparatus that uses successive solidification of layers of a powder-type construction material that can be solidified using radiation. The apparatus comprises an irradiation device for irradiating layers of the construction material that has a plurality of scanners that can separately be actuated, simultaneously irradiating the construction material, the separate detection of irradiation times of each scanner and/or the irradiation areas detected by each scanner, and storing the detected irradiation times and/or irradiation areas; comparing the irradiation times and/or irradiation areas of the scanners with each other; re-determining the surface sections of a powder layer to be irradiated by each scanner so the irradiation times for each scanner are approximated to each other and/or the irradiation areas of each scanner are aligned.