Modified resin systems for liquid resin infusion applications and process methods related thereto
US10836118B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2017 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | May 12, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249921
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A manufacturing process, which includes: (i) preparing a preform; (ii) laying the preform within a mold; (iii) heating the mold to a predetermined temperature; and (iv) injecting a modified resin system, wherein the modified resin system is formulated to have a viscosity below a threshold viscosity at a specific temperature and a high level of toughness. In one embodiment, the modified resin system contains a combination of epoxies, a curing agent, core-shell rubber particles, a thermoplastic material in an amount of less than 7% by weight, wherein in a cured condition, the thermoplastic material is separated into aggregate domains from the base resin, each aggregate domain having an island-like morphology.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.