Encapsulated embedded tire sensor unit
US10836223B1 · kind B1 · utility
1Cited by
31References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2019 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Dec 17, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB60C23/0452
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
An encapsulated sensor unit is embedded in a tire. The encapsulated sensor unit includes a sensor portion and an antenna portion. A first encapsulating layer is disposed about the sensor portion, and not about the antenna portion. A second encapsulating layer is disposed about the first encapsulating layer and the antenna portion. A third encapsulating layer is disposed about the second encapsulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.