Patent · US Active

Tough polyamide moulding material

US10836903B2 · kind B2 · utility

2Cited by

4References

20Claims

0Family size

Assignee

Evonik Operations GmbH · DE

Inventors

Heinrich Peirick · Coesfeld, DE
Jasmin Berger · Dortmund, DE
Franz-Erich Baumann · Schneverdingen, DE

Key dates

Filing date	Aug 11, 2017
Grant date	Nov 17, 2020
Priority date	—
Expiry date	Aug 11, 2037

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2207/53
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A moulding material contains to an extent of at least 50 wt % of the combination of the following constituents a) 80 to 97 parts by mass of a polyamide component containing a1) 70 to 100 parts by wt of PA PACMX (wherein X=8 to 18), and a2) 30 to 0 parts by wt of a linear aliphatic polyamide having on average 8 to 12 carbon atoms in the monomer units, wherein the parts by wt sum to 100, and b) 20 to 3 parts by mass of a core-shell modifier which contains the following: b1) a core which contains 60 to 100 wt % of butadiene units and 0 to 40 wt % of styrene units, wherein the core makes up 60 to 95 wt % of the core-shell modifier; and b2) a shell which contains 80 to 100 wt % of methyl methacrylate units and 0 to 20 wt % of modifying monomer units, wherein the shell makes up 5 to 40 wt % of the core-shell modifier, wherein the parts by mass of a) and b) sum to 100.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.