Composition for forming conductive pattern by irradiation of electromagnetic waves, method for forming conductive pattern using same, and resin structure having conductive pattern
US10837114B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2015 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Nov 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a composition for forming a conductive pattern by irradiation of electromagnetic waves capable of allowing excellent formation of a conductive micro-pattern on various polymer resin products comprising a polycarbonate resin or on resin layers by a simple method such as irradiation of electromagnetic waves and plating, and capable of reducing the degradation of the physical properties of the resin products or resin layers caused by the irradiation of electromagnetic waves, a method for forming a conductive pattern using the same, and a resin structure having a conductive pattern. The composition for forming a conductive pattern by irradiation of electromagnetic waves comprises: a polymer resin comprising a polycarbonate resin; and an electromagnetic wave-absorbing inorganic additive which absorbs an electromagnetic wave having a wavelength in the infrared region and satisfies the characteristic that a laser sensitivity Ls defined by a predetermined relational expression is 1.6<−log(Ls)<6.0.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.