Heat transfer device
US10837711B2 · kind B2 · utility
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1References
12Claims
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Assignee
Inventor
Key dates
| Filing date | Feb 25, 2014 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Feb 25, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat transfer device including a body bounding a cavity for receiving a heat transfer medium, an inlet, and an outlet for providing a fluid connection to the cavity is provided. Interconnecting elements are provided at each of the inlet and outlet for providing a fluid connection to the inlet and the outlet. At least one interconnecting element is configured to interconnect with, and provide relative movement between and a substantially consistent fluid connection with, an interconnecting element of an adjacent device, such as a similar heat transfer device, over a range of spacing between bodies of the devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.