Bump ball testing system and method
US10838001B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2019 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Jul 22, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2884
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit testing system is provided that includes a conductive line connected to a node configured to have a ground voltage. A plurality of conductive structures are coupled to the conductive line. A plurality of test circuits each is configured to supply a test voltage individually to a different conductive structure of the plurality of conductive structures for testing electrical connectivity of each of the different conductive structures. The conductive line is positioned between the node and the test circuits of the plurality of test circuits. A controller is coupled to each of the test circuits of the plurality of test circuits. The controller is configured to cause each of the test circuits of the plurality of test circuits to individually supply the test voltage to each of the different conductive structures of the plurality of conductive structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.