Temperature calculation method, information processing device, and non-transitory recording medium storing temperature calculation program
US10839127B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2016 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Feb 21, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/08
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A temperature calculation method for a substrate, the temperature calculation method includes: calculating, by a computer performing a circuit simulation based on a resistance equivalent to a component that joins two substrates included in a target model of an analysis, a value of a current that flows through the component or voltage values in respective end portions of the component; setting, based on model information for expressing the target model, the current value or the voltage values in a first surface and a second surface that are included in surfaces of an outer shape of the component and that are in contact with the respective substrates; and calculating a first current density distribution of the component by performing a first electrical analysis according to the setting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.