Electronic component and electronic component-mounted structure
US10840008B2 · kind B2 · utility
4Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2016 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | May 10, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic component includes an electronic component body and an external electrode. The external electrode is disposed on the electronic component body. The external electrode includes a Pd plating layer and a Ni plating layer. The Pd plating layer defines an outermost layer. The Ni plating layer is disposed inside the Pd plating layer. The Ni plating layer is partly exposed from the Pd plating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.