Method and apparatus for unpacking semiconductor wafer container
US10840121B2 · kind B2 · utility
0Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2016 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Jan 28, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67196
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.