Semiconductor device
US10840166B2 · kind B2 · utility
0Cited by
6References
8Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 12, 2018 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Sep 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, a semiconductor device includes a first semiconductor chip, a heat dissipation member provided on one surface of the first semiconductor chip and connected to the first semiconductor chip, and a sealing resin sealing the first semiconductor chip and the heat dissipation member. The heat dissipation member includes mutually interlaced metal fibers and a thermosetting resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.