Assembly platform
US10840203B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2017 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | May 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16238
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly platform for arrangement as an interposer device between an integrated circuit and a substrate to interconnect the integrated circuit and the substrate through the assembly platform, the assembly platform comprising: an assembly substrate; a plurality of conducting vias extending through the assembly substrate; at least one nanostructure connection bump on a first side of the assembly substrate, the nanostructure connection bump being conductively connected to the vias and defining connection locations for connection with at least one of the integrated circuit and the substrate, wherein each of the nanostructure connection bumps comprises: a plurality of elongated conductive nanostructures vertically grown on the first side of the assembly substrate, wherein the plurality of elongated nanostructures are embedded in a metal for the connection with at least one of the integrated circuit and the substrate, at least one connection bump on a second side of the assembly substrate, the second side being opposite to the first side, the connection bump being conductively connected to the vias and defining connection locations for connection with at least one of the integrated ci…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.