Semiconductor module
US10840221B2 · kind B2 · utility
0Cited by
13References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2020 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Feb 6, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.