Thermal ground planes and light-emitting diodes
US10840425B2 · kind B2 · utility
0Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2017 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Sep 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0365
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods and systems for thermal management of one or more LEDs are disclosed. One or more LEDs may be coupled with an external layer of a thermal ground plane according to some embodiments described herein. For example, the one or more LEDs may be electrically coupled with a circuit carrier with one or more electrically conductive traces etched therein prior to coupling with the thermal ground plane. The thermal ground plane may be charged with a working fluid and/or hermetically sealed after being coupled with the LED.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.