Superconducting joint using exfoliated ReBCO
US10840616B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 20, 2018 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Aug 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/858
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
According to a first aspect of the present invention, there is provided a method of forming a superconducting joint between ReBCO tapes. Two or more ReBCO tapes are provided, each having an exposed ReBCO region. A bridge is provided, comprising an exposed ReBCO layer and an oxygen-permeable backing on the exposed ReBCO layer. Each exposed ReBCO region is bonded to the exposed ReBCO layer of the bridge by heating to a first temperature (T1) in an environment where the partial pressure of oxygen is sufficiently low that the melting point of the ReBCO (TR) is less than the melting point of silver (TAg), the temperature (T1) being between the melting point of the ReBCO (TR) and the melting point of silver (TAg), (TR<T1<TAg). The resulting joint is annealed at a second temperature (T2) which is less than the melting point of ReBCO (TR) (T2<TR), for a time (t), in an environment where the partial pressure of oxygen is sufficient to reoxygenate the ReBCO at the second temperature (T2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.