Patent · US Active

Method for through-plating a printed circuit board and such a printed circuit board

US10842030B2 · kind B2 · utility

0Cited by

3References

18Claims

0Family size

Assignee

VITESCO TECHNOLOGIES GMBH · DE

Inventors

Jürgen Zacherl · Donaustauf, DE
Erich Mattmann · Heidesheim, DE
Waldemar Brinkis · Nidderau, DE

Key dates

Filing date	Jul 6, 2018
Grant date	Nov 17, 2020
Priority date	—
Expiry date	Jul 6, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1131
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method of through-plating a circuit board having conductors formed on two sides. At least two holes are filled under compression pressure with a sintering paste. Subsequently, the sintering paste is dried and fired to form a cohesive bond with the ceramic substrate and fill the holes. Simultaneous filling of multiple holes having different hole diameters is accomplished using a printing screen with screen holes of different diameters. A single print parameter set is used. The printing screen here has at least one screen hole for filling a hole larger than the reference hole. The screen hole has an area-reducing and area-dividing geometry that divides the screen hole into at least two hole sections.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.