Extended heat sink design in server
US10842054B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2018 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Feb 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20436
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and structure for improving efficiency of cooling and temperature uniformity among a plurality of heat generating electronic devices arranged in rows within a housing, such as a GPU server, utilizing a single source of cooling air. The electronic devices are arranged in a plurality of rows, but the heat sinks for the last row are elevated above the heat sinks of the first row so as to occupy different positions within the cooling air stream. In some embodiments the heat sinks of the electronic devices are extended forward so as to reside near the heat sinks of the electronic devices in the first row, but in a different flow path of cooling air. In other embodiments, a thermo siphon refrigeration system is provided for the electronic devices in the last row, and may be provided for the electronic devices in the first row as well.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.