Seamless stamp device and method for impressing configurations into deformable materials

US10843376B2 · kind B2 · utility

Inventor

• Greg Walter · Cleveland, AU

Key dates

• Filing date: Oct 28, 2017
• Grant date: Nov 24, 2020
• Expiry date: May 30, 2038

Classification

• Technology area (CPC E): Fixed Constructions
• CPC primary: E01C19/43
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

A seamless stamp device for impressing configuration into deformable materials includes a recess member having a substantially planar top wall and an undulating bottom wall with a plurality of ridges integrally joined to the bottom wall, the ridges defining a preselected pattern upon the bottom wall. The seamless stamp device further includes a protrusion member having a substantially planar top wall and an undulating bottom wall with a plurality of ridges integrally joined to the bottom wall, the ridges defining a preselected pattern upon the bottom wall. The recess and protrusion members are detachably engaged such that the undulating bottom walls and ridges of the engaged members provide a continuous, seamless design or pattern in the surface of a deformable material when the recess and protrusion members are forcibly inserted into the deformable material, then vertically elevated and vertically lowered and repositioned upon a different portion of the surface of the deformable material. The method repeating until the entire surface of the deformable material has been configured with the designs of the bottom walls and ridges of the recess and protrusion members.