Patent · US Active

Micromechanical device having a decoupled micromechanical structure

US10843917B2 · kind B2 · utility

0Cited by

2References

11Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Steffen Zunft · Reutlingen, DE
Bonsang Kim · Mountain View, US
Ando Feyh · Palo Alto, US
Andrew Graham · Redwood City, US
Gary O'Brien · Palo Alto, US
Michael Baus · Bietigheim-Bissingen, DE
Ralf Maier · Neuendorf, DE
Mariusz Koc · Stuttgart, DE

Key dates

Filing date	Apr 5, 2017
Grant date	Nov 24, 2020
Priority date	—
Expiry date	Apr 5, 2037

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/0118
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A micromechanical device having a substrate wafer, a functional layer situated above it which has a mobile micromechanical structure, and a cap situated on top thereof, having a first cavity, which is formed at least by the substrate wafer and the cap and which includes the micromechanical structure. The micromechanical device has a fixed part and a mobile part, which are movably connected to each other with at least one spring element, and the first cavity is situated in the mobile part. Also described is a method for producing the micromechanical device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.