Polyamide acid, thermoplastic polyimide, resin film, metal-clad laminate and circuit board
US10844175B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2017 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Feb 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0154
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide acid which contains at least one diamine compound selected from among diamine compounds represented by general formula (8) within the range of 3-60 parts by mole in total per 100 parts by mole of all diamine components, while containing a biphenyl tetracarboxylic acid dianhydride within the range of 40-100 parts by mole and a pyromellitic acid dianhydride within the range of 0-60 parts by mole per 100 parts by mole of all acid anhydride components; and a thermoplastic polyimide which is obtained curing this polyamide acid. (In formula (8), linking group X represents a single bond or a divalent group selected from among —CONH—; each Y independently represents a hydrogen atom, a monovalent hydrocarbon group having 1-3 carbon atoms or an alkoxy group; n represents an integer of 0-2; and each of p and q independently represents an integer of 0-4.)
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.