Copper alloy sheet material and current-carrying component
US10844468B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2014 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Aug 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/026
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A copper alloy sheet material contains, in mass %, Fe: 0.05 to 2.50%, Mg: 0.03 to 1.00%, and P: 0.01 to 0.20%, and the contents of these elements satisfy the relation Mg-1.18(P—Fe/3.6)3 0.03. The Mg solid-solution ratio determined by the amount of dissolved Mg (mass %)/the Mg content of the alloy (mass %) ’ 100 is 50% or more. The density of an Fe—P-based compound having a particle size of 50 nm or more is 10.00 particles/10 mm2 or less, and the density of an Mg—P-based compound having a particle size of 100 nm or more is 10.00 particles/10 mm2 or less. The Cu—Fe—P—Mg-based copper alloy sheet material is excellent in terms of electrical conductivity, strength, bending workability, and stress relaxation resistance in the case where load stress is applied in a direction perpendicular to both a rolling direction and a sheet thickness direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.