Patent · US Active

Cooling device

US10845127B2 · kind B2 · utility

0Cited by
0References
15Claims
0Family size

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Key dates

Filing dateSep 5, 2017
Grant dateNov 24, 2020
Priority date
Expiry dateNov 23, 2037

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF28F2265/14
  • WIPO fieldThermal processes and apparatus
  • WIPO sectorMechanical engineering

Abstract

A cooling device of an embodiment includes an evaporator, a condenser, a first connection pipe, a second connection pipe, and a third connection pipe. A refrigerant is vaporized in the evaporator by heat generated by a heating element. The condenser is located above the evaporator, and configured to condense the vaporized refrigerant by exchanging heat with an external fluid. The first connection pipe guides the refrigerant vaporized by the evaporator to the condenser. The second connection pipe guides the refrigerant condensed by the condenser to the evaporator. The third connection pipe connects a portion of the first connection pipe and a portion of the second connection pipe. A connection position between the third connection pipe and the first connection pipe is higher than a maximum liquid level height of the refrigerant in the second connection pipe during an operation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.