Semiconductor device and method of manufacturing the same
US10845406B2 · kind B2 · utility
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17Claims
0Family size
Assignee
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Key dates
| Filing date | May 17, 2019 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | May 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/10
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure provides a semiconductor device and a method of manufacturing the same, and relates to the field of semiconductor devices. The semiconductor device includes an active region, a test region and a passive region located outside the active region and the test region, wherein a standard device is formed in the active region, and a test device for testing performance parameters of the standard device is formed in the test region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.