Printed circuit boards with anti-warping molding portions and related semiconductor packages and methods of fabricating
US10847473B2 · kind B2 · utility
1Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2018 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Aug 11, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package can include a substrate and a semiconductor chip on the substrate. A first molding portion can cover the semiconductor chip and can include a first sidewall and a second sidewall opposite each other. A second molding portion can extend on the substrate along the first sidewall and along the second sidewall, where the first molding portion can include a nonconductive material, and the second molding portion can include a conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.