Method for fabricating array substrate motherboard, array substrate motherboard and detection method
US10847554B2 · kind B2 · utility
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Key dates
| Filing date | May 2, 2018 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | May 2, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for fabricating an array substrate motherboard, an array substrate motherboard and a detection method are provided. The method for fabricating an array substrate motherboard includes depositing a first film on a substrate, wherein a first gap is present between the edge of the first film and the edge of the substrate, coating photoresist on the substrate on which the first film is deposited, and exposing and developing the photoresist to form a first scale pattern from the photoresist. One end of the first scale pattern is flush with the edge of the substrate and the other end covers the first film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.