Coupling a semiconductor component to a target substrate by transfer printing
US10847673B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Apr 1, 2019 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Apr 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure is related to a method for producing at least one semiconductor component coupled to a target substrate, where a coupon comprising one or more constituent layers of the at least one semiconductor component is transferred to the target substrate by transfer printing. The coupon is embedded in a portion of a support layer thereby forming an enlarged coupon provided with solid alignment markers on the underside thereof. Corresponding hollow alignment markers exist on the location of the target substrate where the coupon is to be placed. The alignment markers engage to thereby align the coupon to the target location. The disclosure is equally related to a device assembly obtainable by the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.