Optoelectronic component and method of manufacturing an optoelectronic component

US10847684B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Jörg Frischeisen · Birkenfeld, DE
• Angela Eberhardt · Augsburg, DE
• Florian Peskoller · Ingolstadt, DE
• Thomas Huckenbeck · Augsburg, DE
• Michael Schmidberger · Schwabmünchen, DE
• Jürgen Bauer · Pocking, DE

Key dates

• Filing date: Feb 21, 2018
• Grant date: Nov 24, 2020
• Expiry date: Feb 21, 2038

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C03C2217/944
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

An optoelectronic component includes a semiconductor layer sequence having an active region that emits radiation during operation at least via a main radiation exit surface, and a self-supporting conversion element arranged in a beam path of the semiconductor layer sequence, wherein the self-supporting conversion element includes a substrate and a first layer, the first layer includes at least one conversion material embedded in a glass matrix, the glass matrix has a proportion of 50 to 80 vol. % in the first layer, the substrate is free of the glass matrix and the conversion material and mechanically stabilizes the first layer, and the first layer has a layer thickness of less than 200 μm.