Light emitting device and lead frame with resin
US10847693B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2018 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Jul 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting device includes a resin package having a rectangular shape in a top view and two short-side lateral surfaces and two long-side lateral surfaces. The two short-side lateral surfaces include a first external surface and a second external surface located on an opposite side from the first external surface. The two long-side lateral surfaces include a third external surface and a fourth external lateral surface located on an opposite side from the third external lateral surface. The lead is not exposed on the third external lateral surface nor the fourth external lateral surface. The first lead is exposed at the first external lateral surface and the second external lateral surface, respectively flush with the resin member at the first external lateral surface and the second external lateral surface. The second lead is exposed at the second external lateral surface, flush with the resin part at the second external lateral surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.