Sensor housings, modules, and luminaires incorporating the same comprising a heat sink integrated with one or more walls defining a cavity accepting a sensor
US10848650B2 · kind B2 · utility
0Cited by
4References
39Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 16, 2017 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Oct 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/52
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Sensor housings, modules, and luminaires comprising the same are provided. The sensor housings and modules set forth herein have improved heat sinking abilities for dissipating heat from a sensor while simultaneously facilitating thermal isolation of the sensor. Briefly, a sensor housing described herein comprises a cavity for housing a sensor and a heat sink. The heat sink is configured to dissipate heat from the sensor housing and thermally isolate the sensor housing from other heat generating components, such as other portions of a luminaire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.