Headphone earcup mount in continuous headband-spring headphone system
US10848870B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2020 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Jul 7, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2205/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various implementations include headphone systems. In one implementation a headband for a headphone system includes: a continuous spring section sized to extend over a head of a user; an earcup mount coupled with an end of the continuous spring section, forming an arcuate joint, where the earcup mount is configured to rotate relative to the continuous spring section at the arcuate joint; and a friction assembly spanning between the continuous spring section and the earcup mount, and configured to provide a substantially constant resistance to the rotation of the earcup mount relative to the continuous spring section, the friction assembly including a coupler having: an upper collar in the continuous spring section, the upper collar comprising a radial protrusion; and a lower collar in the earcup mount, the lower collar comprising a rotation stop for interacting with the radial protrusion in the upper collar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.