High temperature resistant fabric and its use in flexible circuits
US10849222B2 · kind B2 · utility
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4References
3Claims
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Key dates
| Filing date | Nov 14, 2017 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Nov 14, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0113
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided herein are embodiments of a PWB circuit construction material, and its use in flexible PWB circuits. The PWB circuit construction material is made up of temperature resistant fabric bonded to a metal substrate using a bonding agent. The temperature resistant material may include synthetic aromatic polyamide fibers. The fabric may be used as a reinforcement for the standard PWB construction materials for flexible PWB circuits and as a standalone piece that is bonded as a hinge at rigid portions of a rigid or rigid-flexible PWB circuit to reduce the thermal effects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.