Multi-socket server assembly
US10849223B2 · kind B2 · utility
1Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2019 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Mar 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10325
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In some examples, a printed circuit board assembly can include a printed circuit board having four (4) central processor unit (CPU) sockets disposed thereon and sixty four (64) dual in-line memory modules (DIMMs) disposed thereon. The printed circuit board can have a top surface and a bottom surface with two (2) CPU sockets and thirty two (32) DIMMs disposed on the top surface and two (2) CPU sockets and thirty two (32) DIMMs disposed on the bottom surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.