Preparation of electrical circuits by adhesive transfer
US10849234B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2017 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Jun 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/095
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Multilayer articles that include electrical circuits are prepared by the adhesive transfer of electrical circuit elements to the surface of an adhesive. A number of different methodologies are used, with all of the methodologies including the use of simple layers of circuit-forming material on a releasing substrate and structuring to generate circuit elements which can be transferred to an adhesive surface. In some methodologies, a structured releasing substrate is used to selectively transfer circuit-forming material, either from protrusions on the releasing substrate or from depressions on the releasing substrate. In other methodologies, an unstructured releasing substrate is used and either embossed to form a structured releasing substrate or contacted with a structured adhesive layer to selectively transfer circuit-forming material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.