Devices, systems, and methods for thermal management of rack-mounted computing infrastructure devices
US10849254B2 · kind B2 · utility
0Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2019 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Dec 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20836
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Devices, systems, and methods for thermal management provide conditioned air from an inlet of an electronics cabinet to a rear-mounted interface device using an enclosure mounted in the electronics cabinet. The enclosure is laterally expandable in order to make installation easier and to enable installation of the enclosure between electronics cabinets of several mounting widths. The enclosure is installed to an internal surface of the mounting rails of the electronics cabinet so that the interface devices are mounted directly to the mounting rails, so the enclosure does not support the mass of the interface devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.